July 2014

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Jul 04 11:00 am

AMEE-LIFEPASS Research Seminar No.3 by Professor K M Lee - ML362 (Michael Stirling Building), 11.00am on Friday 4th July

Seminar, ML362 (Michael Stirling Building)

Paradigm Shift, Challenges and Opportunities in Mechatronics, Intelligent Manufacturing and Innovative Applications Professor Kok-Meng Lee, IEEE Fellow, ASME Fellow Editor-in-Chief, IEEE/ASME Transactions on Mechatronics Professor, George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta, Georgia 30332-0405, USA Email: Abstract: The growth of computing, communication and control (3C) technologies has played an important role in the rapid advances of robotics, automation and mechatronics (RAM). Over the last three decades, the 3C technologies have undergone several evolutions; notably the increase in frequency and transistor density in embedded processors, the convergence of several consumer electronics (watch, phone, camera, PDA, etc.), the connectivity of mobile applications to the internet, and more recently the decoupling of computing and storage together with exponential growth of massive data processing leading to cloud computing. This talk begins with examining the effect of the major paradigm shift in 3C technologies on RAM and innovative applications which evolve in parallel with societal changes in response to concerns in energy, transport and mobility, aging population and healthcare, environment, productivity and safety. Selected examples are given to help illustrate unique opportunities and challenges presented to mechatronics and intelligent manufacturing with focuses on new approaches that take advantages of many similarities to those existing in natural processes; notably the nature inspired solutions. The intended audience of this talk includes undergraduates, graduate students and faculty with technology backgrounds. The objective is to stimulate discussion of the future of RAM research and its potential application to the problems facing society in a rapidly changing world.

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